CH-HTE/高溫高延宕率電解銅箔

經過過程對傳統的原箔電鍍工藝停止改良，生産出高溫高延宕率電解銅箔，具有良好的常溫與 高溫功傚，具有良好的高耐折特徵，而且經事先處理後畱存良好的連系力。/By improving the traditional original foil electroplating process, high temperature and high elongation electrolytic copper foil is produced, which has excellent properties at room temperature and high temperature, excellent folding resistance, and excellent adhesion after post-treatment.

• 實用於高密度互連技術板與柔性電路板/Suitable for HDI and FPC PCB.

産品/技術優勢/Advantages of Product/ Technology

• 優良的高溫延宕率/Excellent high temperature elongation
• 良好的高耐折特徵/Excellent folding resistance
• 較低的粗糙度/Lower roughness
• 良好的基材連系力/Excellent substrate adhesion

産品/技術利用規模Application Area(s) of Product/ Technology

單麪板、雙麪板、和壹切FR-4、CEM-1、CEM-3品種的基板/single-sided, double-sided PCB, and FR-4、CEM-1、CEM-3 substrate

代表特徵數據/Representive date